[News] SEMI Sees Americas Fab Tool Spending Double to US$40.6B by 2029 as TSMC, Intel, Micron, Samsung Expand

AI-driven demand is translating into substantial semiconductor manufacturing investments, fueling growth in equipment spending, fab construction, and ...

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AI-driven demand is translating into substantial semiconductor manufacturing investments, fueling growth in equipment spending, fab construction, and production capacity worldwide.

At SEMICON West 2026, SEMI Senior Director Clark Tseng noted that the industry is expected to maintain strong expansion momentum over the next several years.

According to TechNews , SEMI’s latest report projects global 300mm fab equipment spending to rise from US$113 billion in 2025 to approximately US$149 billion in 2026, up 31% YoY, before reaching US$227 billion in 2029.

Annual spending is expected to maintain double-digit percentage growth throughout 2026–2029.

Tseng emphasized that the growth is not merely a short-term AI-driven spending surge, but reflects sustained investment in advanced logic, advanced memory, and other 300mm wafer technologies, with equipment spending gradually translating into expanded manufacturing capacity, the report adds.

SEMI expects construction to begin on 20 new 300mm fabs or production lines worldwide in 2026 and another 18 in 2027, excluding R&D-only facilities.

Of these, three and four, respectively, are expected to be in the U.S.

Meanwhile, the number of facilities beginning operations or producing their first wafers is projected to rise from 13 in 2026 to 23 in 2027.

Global fab construction spending is also forecast to increase from nearly US$48 billion in 2026 to US$63 billion in 2027 and US$68 billion in 2028, according to the report.

As TechNews highlights, SEMI expects 300mm fab equipment spending in the Americas, largely driven by U.S.

investment, to more than double from US$18.1 billion in 2026 to US$40.6 billion in 2029.

Key projects include advanced logic and foundry expansions by Intel, TSMC, and Samsung, DRAM capacity additions by Micron, and increased analog and embedded processing capacity from Texas Instruments.