Global 300mm fab equipment spending to hit $227 billion by 2029

Global 300mm fab equipment spending is forecast to reach $227 billion by 2029, expanding semiconductor manufacturing capacity.

Global 300mm fab equipment spending to hit $227 billion by 2029 Market news | October 14, 2026 By Asma Adhimi Semiconductor Fab semiconductor 300mm Fabs semiconductor manufacturing 300mm Wafers Global spending on 300mm semiconductor fab equipment is set to reach $227 billion by 2029, driven by growing demand for AI chips, high-performance computing and advanced semiconductor manufacturing.

According to the latest forecast from SEMI , equipment investment will jump 31% year-over-year to $149 billion in 2026, with double-digit growth expected to continue through 2029.

The outlook signals significant opportunities for European semiconductor equipment suppliers, materials providers and companies across the chip manufacturing supply chain.

It also highlights how the global race to expand semiconductor production capacity is translating into new fab construction and equipment orders.

The semiconductor industry’s manufacturing expansion is accelerating, with SEMI forecasting 20 new 300mm fabs or production lines to begin construction worldwide in 2026, followed by another 18 in 2027.

These figures exclude facilities dedicated solely to research and development.

Construction spending across all 300mm facilities is expected to increase 23% to $47.5 billion in 2026, followed by a further 33% rise to $63.3 billion in 2027.

Investment is projected to reach $68.4 billion in 2028.

The spending surge reflects continued capacity expansion in leading-edge logic, memory and other semiconductor technologies as chipmakers prepare for rising demand.

“Semiconductor demand is increasingly translating into physical manufacturing expansion across the global industry,” said Ajit Manocha, SEMI President and CEO.

“The latest outlook points to both stronger equipment investment and a substantial pipeline of fabs moving toward operation.

This expansion will provide the manufacturing foundation needed to support AI, high-performance computing and a broad range of next-generation semiconductor applications.” The Americas are emerging as a major driver of the global expansion, with regional 300mm fab equipment spending expected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029.