Episode 20: Invisible Resin Protecting Exposed Chips at Sumitomo Bakelite's Utsunomiya Plant | Keihin-Keiyo Petrochemical Hub Stories

Previous Episode From petrochemical complexes to functional material plants in North Kanto.

A series titled "Dive In: The Present of Chemistry" that deciphers the chemistry working deep within our ...

From petrochemical complexes to functional material plants in North Kanto.

A series titled "Dive In: The Present of Chemistry" that deciphers the chemistry working deep within our daily lives, starting from its hubs.

Episode 20 is the story of a plant in Utsunomiya City, Tochigi Prefecture, that produces liquid resins that connect semiconductor chips to substrates and protect them from heat and moisture.

Whether you drop your smartphone or a car drives on a hot summer road, the semiconductors inside the screen and control units continue to calculate silently.

It must continue to function for a long time while being in contact with metal terminals that conduct electricity, substrates that dissipate heat, and moisture contained in the outside air.

First, die-bonding paste fixes the chip to the substrate.

"Die" refers to the semiconductor chip, and "bonding" means joining.

Some pastes have the role of not only adhering but also creating a path for heat to escape.

Encapsulation means covering electronic components with resin to protect them from moisture, dust, vibration, and corrosive air.

It enters narrow gaps in a liquid state, and after hardening through heating or other means, it becomes a shell that cradles the component.

Semiconductors do not become products with computing power alone.

Chemistry that allows them to continue working without breaking is ultimately necessary.

Inside a semiconductor, silicon, copper, solder, resin, and substrates are lined up.

Each has a different rate of expansion and contraction with temperature.

The power turns on and it gets hot, then it turns off and cools down.

Through this repetition, small forces continue to be applied to the interfaces.

From petrochemical complexes to functional material plants in North Kanto.

A series titled "Dive In: The Present of Chemistry" that deciphers the chemistry working deep within our daily lives, starting from its hubs.

Episode 20 is the story of a plant in Utsunomiya City, Tochigi Prefecture, that produces liquid resins that connect semiconductor chips to substrates and protect them from heat and moisture.

Whether you drop your smartphone or a car drives on a hot summer road, the semiconductors inside the screen and control units continue to calculate silently.

It must continue to function for a long time while being in contact with metal terminals that conduct electricity, substrates that dissipate heat, and moisture contained in the outside air.

First, die-bonding paste fixes the chip to the substrate.

"Die" refers to the semiconductor chip, and "bonding" means joining.

Some pastes have the role of not only adhering but also creating a path for heat to escape.

Encapsulation means covering electronic components with resin to protect them from moisture, dust, vibration, and corrosive air.

It enters narrow gaps in a liquid state, and after hardening through heating or other means, it becomes a shell that cradles the component.

Semiconductors do not become products with computing power alone.